مؤتمر
Comparative Study of Solder Strength Characterization for BGA Packages
| العنوان: | Comparative Study of Solder Strength Characterization for BGA Packages |
|---|---|
| المؤلفون: | Liu, Vance, Lai, Show, Zou, Mason, Chen, Jeremy, Gan, Cl, Takiar, Hem |
| المصدر: | 2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC) Electronics Packaging Technology Conference (EPTC), 2021 IEEE 23rd. :427-429 Dec, 2021 |
| Relation: | 2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC) |
| قاعدة البيانات: | IEEE Xplore Digital Library |
| ردمك: | 9781665416191 |
|---|---|
| DOI: | 10.1109/EPTC53413.2021.9663946 |