مؤتمر
Comparative Study of Solder Strength Characterization for BGA Packages
العنوان: | Comparative Study of Solder Strength Characterization for BGA Packages |
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المؤلفون: | Liu, Vance, Lai, Show, Zou, Mason, Chen, Jeremy, Gan, Cl, Takiar, Hem |
المصدر: | 2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC) Electronics Packaging Technology Conference (EPTC), 2021 IEEE 23rd. :427-429 Dec, 2021 |
Relation: | 2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC) |
قاعدة البيانات: | IEEE Xplore Digital Library |
ردمك: | 9781665416191 |
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DOI: | 10.1109/EPTC53413.2021.9663946 |