التفاصيل البيبلوغرافية
العنوان: |
Organic Panel Fine Circuit Pattern Inspection and Metrology for Readiness |
المؤلفون: |
Xue, Feng, Reynolds, Charles, Wassick, Tom, Pomerantz, Glenn, Zou, Zhihua, Santos, Anna Lucy, Tang, Neil, Lin, Alison Yu-Ting, Yang, Channing Cheng-Lin, Huang, Jing-Sian, Cheng, Billy Chung-Yu, Tsuriya, Masahiro |
المصدر: |
2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC) Electronics Packaging Technology Conference (EPTC), 2021 IEEE 23rd. :99-103 Dec, 2021 |
Relation: |
2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC) |
قاعدة البيانات: |
IEEE Xplore Digital Library |