Organic Panel Fine Circuit Pattern Inspection and Metrology for Readiness

التفاصيل البيبلوغرافية
العنوان: Organic Panel Fine Circuit Pattern Inspection and Metrology for Readiness
المؤلفون: Xue, Feng, Reynolds, Charles, Wassick, Tom, Pomerantz, Glenn, Zou, Zhihua, Santos, Anna Lucy, Tang, Neil, Lin, Alison Yu-Ting, Yang, Channing Cheng-Lin, Huang, Jing-Sian, Cheng, Billy Chung-Yu, Tsuriya, Masahiro
المصدر: 2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC) Electronics Packaging Technology Conference (EPTC), 2021 IEEE 23rd. :99-103 Dec, 2021
Relation: 2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC)
قاعدة البيانات: IEEE Xplore Digital Library
الوصف
ردمك:9781665416191
DOI:10.1109/EPTC53413.2021.9663960