مؤتمر
Bunch of Wires Interface PHY Design for Multi-Chiplet Systems
| العنوان: | Bunch of Wires Interface PHY Design for Multi-Chiplet Systems |
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| المؤلفون: | Ahmed, Maudood, Chaudhary, Muhammad Waqas, Heinig, Andy |
| المصدر: | 2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC) Electronics Packaging Technology Conference (EPTC), 2021 IEEE 23rd. :395-398 Dec, 2021 |
| Relation: | 2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC) |
| قاعدة البيانات: | IEEE Xplore Digital Library |
| ردمك: | 9781665416191 |
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| DOI: | 10.1109/EPTC53413.2021.9663983 |