التفاصيل البيبلوغرافية
| العنوان: |
Diffusion and oxidation of copper in polymer of Fan Out-Panel Level Package (FO-PLP) under High Temperature Storage (HTS) Conditions |
| المؤلفون: |
Yu, Yeonseop, Ha, Job, Park, Mijin, Kim, Miyang, Yang, Eunju |
| المصدر: |
2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC) Electronics Packaging Technology Conference (EPTC), 2021 IEEE 23rd. :213-217 Dec, 2021 |
| Relation: |
2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC) |
| قاعدة البيانات: |
IEEE Xplore Digital Library |
