مؤتمر
Analysis of transmission line structures using a dynamic analysis through WIPL-D
| العنوان: | Analysis of transmission line structures using a dynamic analysis through WIPL-D |
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| المؤلفون: | Stamm, J., Sarkar, T., Kolundzija, B., Salazar-Palma, M. |
| المصدر: | IEEE 10th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No. 01TH8565) Electrical performance of electronic packaging Electrical Performance of Electronic Packaging, 2001. :55-58 2001 |
| Relation: | IEEE 10th Topical Meeting on Electrical Performance of Electronic Packaging |
| قاعدة البيانات: | IEEE Xplore Digital Library |
Full Text Finder | ردمك: | 0780370244 9780780370241 |
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| DOI: | 10.1109/EPEP.2001.967610 |