دورية أكاديمية
Effect of Titanium-Polymer Interactions on Adhesion of Polymer-Copper Redistribution Layers in Advanced Packaging
| العنوان: | Effect of Titanium-Polymer Interactions on Adhesion of Polymer-Copper Redistribution Layers in Advanced Packaging |
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| المؤلفون: | Nimbalkar, P., Blancher, C., Kathaperumal, M., Swaminathan, M., Tummala, R. |
| المصدر: | IEEE Transactions on Device and Materials Reliability IEEE Trans. Device Mater. Relib. Device and Materials Reliability, IEEE Transactions on. 22(1):59-64 Mar, 2022 |
| قاعدة البيانات: | IEEE Xplore Digital Library |
Full Text Finder | تدمد: | 15304388 15582574 |
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| DOI: | 10.1109/TDMR.2022.3141940 |