دورية أكاديمية
Enhancement of Bi-2223 Intergrain Connections by Heat Treatment Parameters Optimization
| العنوان: | Enhancement of Bi-2223 Intergrain Connections by Heat Treatment Parameters Optimization |
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| المؤلفون: | Zhang, S., Shao, B., Zhang, W., Ma, X., Liu, J., Liu, X., Feng, J., Li, C., Zhang, P. |
| المصدر: | IEEE Transactions on Applied Superconductivity IEEE Trans. Appl. Supercond. Applied Superconductivity, IEEE Transactions on. 32(4):1-4 Jun, 2022 |
| قاعدة البيانات: | IEEE Xplore Digital Library |
Full Text Finder | تدمد: | 10518223 15582515 23787074 |
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| DOI: | 10.1109/TASC.2022.3144126 |