التفاصيل البيبلوغرافية
| العنوان: |
3D interconnection using copper direct hybrid bonding for GaN on silicon wafer |
| المؤلفون: |
Dubarry, C., Arnaud, L., Munoz, M. L. Calvo, Mauguen, G., Moreau, S., Crochemore, R., Bresson, N., Aventurier, B. |
| المصدر: |
2021 IEEE International 3D Systems Integration Conference (3DIC) 3D Systems Integration Conference (3DIC), 2021 IEEE International. :1-4 Oct, 2021 |
| Relation: |
2021 IEEE International 3D Systems Integration Conference (3DIC) |
| قاعدة البيانات: |
IEEE Xplore Digital Library |
