التفاصيل البيبلوغرافية
| العنوان: |
Thermal Aware Floorplanner for Multi-Layer ICs with Fixed-Outline Constraints |
| المؤلفون: |
Shanthi, J., Rani, D. Gracia Nirmala, Rajaram, S. |
| المصدر: |
2021 2nd International Conference on Communication, Computing and Industry 4.0 (C2I4) Communication, Computing and Industry 4.0 (C2I4), 2021 2nd International Conference on. :1-6 Dec, 2021 |
| Relation: |
2021 2nd International Conference on Communication, Computing and Industry 4.0 (C2I4) |
| قاعدة البيانات: |
IEEE Xplore Digital Library |
