Substrate-Free Dissolvable Microneedles with Barbed Structure Prepared by Modified Dual-Moulding Processes

التفاصيل البيبلوغرافية
العنوان: Substrate-Free Dissolvable Microneedles with Barbed Structure Prepared by Modified Dual-Moulding Processes
المؤلفون: Ren, Yingjie, Li, Junshi, Huang, Dong, Cao, Lu, Wu, Pengfei, Huang, Yuanyu, Li, Zhihong
المصدر: 2022 IEEE 35th International Conference on Micro Electro Mechanical Systems Conference (MEMS) Micro Electro Mechanical Systems Conference (MEMS), 2022 IEEE 35th International Conference on. :404-407 Jan, 2022
Relation: 2022 IEEE 35th International Conference on Micro Electro Mechanical Systems Conference (MEMS)
قاعدة البيانات: IEEE Xplore Digital Library
الوصف
ردمك:9781665409117
تدمد:21601968
DOI:10.1109/MEMS51670.2022.9699679