An Embedded Hd-Semg Sensor Modified with a Self-Adhesive Gel with Ultra-Low Contact Resistance, Balanced Flexibility and Repeatability

التفاصيل البيبلوغرافية
العنوان: An Embedded Hd-Semg Sensor Modified with a Self-Adhesive Gel with Ultra-Low Contact Resistance, Balanced Flexibility and Repeatability
المؤلفون: Zhao, Nan, Shen, Gencai, Jiang, Chunpeng, Wang, Zhuangzhuang, Wang, Ruijia, Wang, Xiaolin, Yang, Bin, Lin, Zude, Liu, Jingquan
المصدر: 2022 IEEE 35th International Conference on Micro Electro Mechanical Systems Conference (MEMS) Micro Electro Mechanical Systems Conference (MEMS), 2022 IEEE 35th International Conference on. :357-360 Jan, 2022
Relation: 2022 IEEE 35th International Conference on Micro Electro Mechanical Systems Conference (MEMS)
قاعدة البيانات: IEEE Xplore Digital Library
الوصف
ردمك:9781665409117
تدمد:21601968
DOI:10.1109/MEMS51670.2022.9699823