التفاصيل البيبلوغرافية
العنوان: |
Simulation Analysis of Electric Field and Mechanical Stress of Ceramic Supporting Insulator in UHVDC Wall Bushing |
المؤلفون: |
Dong, Hao, Yang, Zhuodong, Yang, Xiao, Lu, Licheng, Zhang, Yi, Qi, Bo, Li, Chengrong |
المصدر: |
2021 IEEE Conference on Electrical Insulation and Dielectric Phenomena (CEIDP) Electrical Insulation and Dielectric Phenomena (CEIDP), 2021 IEEE Conference on. :407-410 Dec, 2021 |
Relation: |
2021 IEEE Conference on Electrical Insulation and Dielectric Phenomena (CEIDP) |
قاعدة البيانات: |
IEEE Xplore Digital Library |