Dipole-First Gate Stack as a Scalable and Thermal Budget Flexible Multi-Vt Solution for Nanosheet/CFET Devices

التفاصيل البيبلوغرافية
العنوان:	Dipole-First Gate Stack as a Scalable and Thermal Budget Flexible Multi-Vt Solution for Nanosheet/CFET Devices
المؤلفون:	Arimura, H., Ragnarsson, L.-A., Oniki, Y., Franco, J., Vandooren, A., Brus, S., Leonhardt, A., Sippola, P., Ivanova, T., Verni, G. Alessio, Chang, R.-J., Xie, Q., Givens, M., Mitard, J., Biesemans, S., Litta, E. Dentoni, Horiguchi, N.
المصدر:	2021 IEEE International Electron Devices Meeting (IEDM) Electron Devices Meeting (IEDM), 2021 IEEE International. :13.5.1-13.5.4 Dec, 2021
Relation:	2021 IEEE International Electron Devices Meeting (IEDM)
قاعدة البيانات:	IEEE Xplore Digital Library