التفاصيل البيبلوغرافية
| العنوان: |
Novel methodology for 3D FEM modeling of wire bonding process by ball deformation reproduction |
| المؤلفون: |
Guarino, L., Caglio, C., Villa, R., Zullino, L., Cecchetto, L. |
| المصدر: |
2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2022 23rd International Conference on. :1-6 Apr, 2022 |
| Relation: |
2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) |
| قاعدة البيانات: |
IEEE Xplore Digital Library |
