التفاصيل البيبلوغرافية
| العنوان: |
Model Order Reduction of a Thermo-Mechanical Packaged Chip Model for automotive MOSFET applications |
| المؤلفون: |
Umunnakwe, C. B., Zawra, I., Yuan, C., Rudnyi, E. B., Hohlfeld, D., Niessner, M., Bechtold, T. |
| المصدر: |
2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2022 23rd International Conference on. :1-5 Apr, 2022 |
| Relation: |
2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) |
| قاعدة البيانات: |
IEEE Xplore Digital Library |
