Investigation on Contacts Thermal Stability for 3D Sequential Integration

التفاصيل البيبلوغرافية
العنوان:	Investigation on Contacts Thermal Stability for 3D Sequential Integration
المؤلفون:	Mao, S. J., Liu, J. B., Wang, Y., Liu, W. B., Hu, Y. P., Cui, H. W., Zhang, R., Liu, H. C., Wang, Z. X., Zhou, N., Zhang, Y. K., Yang, H., Wu, Z. H., Li, Y. L., Gao, J. F., Du, A. Y., Li, J. F., Luo, J., Wang, W. W., Yin, H. X.
المصدر:	2022 IEEE International Reliability Physics Symposium (IRPS) Reliability Physics Symposium (IRPS), 2022 IEEE International. :P37-1-P37-4 Mar, 2022
Relation:	2022 IEEE International Reliability Physics Symposium (IRPS)
قاعدة البيانات:	IEEE Xplore Digital Library