دورية أكاديمية
Monitoring of Cylindrical Plunge Grinding Process by Electromechanical Impedance
| العنوان: | Monitoring of Cylindrical Plunge Grinding Process by Electromechanical Impedance |
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| المؤلفون: | Ferreira, F.I., de Aguiar, P.R., Silva, R.B.d., Jackson, M.J., Baptista, F.G., Bianchi, E.C. |
| المصدر: | IEEE Sensors Journal IEEE Sensors J. Sensors Journal, IEEE. 22(12):12314-12322 Jun, 2022 |
| قاعدة البيانات: | IEEE Xplore Digital Library |
Full Text Finder | تدمد: | 1530437X 15581748 23799153 |
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| DOI: | 10.1109/JSEN.2022.3172230 |