التفاصيل البيبلوغرافية
| العنوان: |
SPV Panel Hotspot Thermal Profile Modeling and Characterization with Active Cooling Employing CAD Simulation |
| المؤلفون: |
Reddy, Polaka Divya, Kakani, Pranavi, Ramaneti, Ketan, Prakash, Surya |
| المصدر: |
2022 IEEE International Conference on Signal Processing, Informatics, Communication and Energy Systems (SPICES) Signal Processing, Informatics, Communication and Energy Systems (SPICES), 2022 IEEE International Conference on. 1:77-80 Mar, 2022 |
| Relation: |
2022 IEEE International Conference on Signal Processing, Informatics, Communication and Energy Systems (SPICES) |
| قاعدة البيانات: |
IEEE Xplore Digital Library |
