دورية أكاديمية
Next-Generation High-Density PCB Development by Fan-Out RDL Technology
| العنوان: | Next-Generation High-Density PCB Development by Fan-Out RDL Technology |
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| المؤلفون: | Shih, M., Huang, Y., Lin, G. |
| المصدر: | IEEE Transactions on Device and Materials Reliability IEEE Trans. Device Mater. Relib. Device and Materials Reliability, IEEE Transactions on. 22(2):296-305 Jun, 2022 |
| قاعدة البيانات: | IEEE Xplore Digital Library |
Full Text Finder | تدمد: | 15304388 15582574 |
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| DOI: | 10.1109/TDMR.2022.3174604 |