دورية أكاديمية

On the Correlation Between Near-Field Scan Immunity and Radiated Immunity at Printed Circuit Board Level – Part II

التفاصيل البيبلوغرافية
العنوان: On the Correlation Between Near-Field Scan Immunity and Radiated Immunity at Printed Circuit Board Level – Part II
المؤلفون: Boyer, A., Nolhier, N., Caignet, F., Dhia, S.B.
المصدر: IEEE Transactions on Electromagnetic Compatibility IEEE Trans. Electromagn. Compat. Electromagnetic Compatibility, IEEE Transactions on. 64(5):1493-1505 Oct, 2022
قاعدة البيانات: IEEE Xplore Digital Library
الوصف
تدمد:00189375
1558187X
DOI:10.1109/TEMC.2022.3172601