مؤتمر
Special glass for packaging of high frequency electronics
| العنوان: | Special glass for packaging of high frequency electronics |
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| المؤلفون: | Letz, M., Engelmann, H., Lautenschlager, G., Brune, N., Bai, Xiaofei, Salski, B., Karpisz, T. |
| المصدر: | 2021 51st European Microwave Conference (EuMC) European Microwave Conference (EuMC), 2021 51st. :103-106 Apr, 2022 |
| Relation: | 2021 51st European Microwave Conference (EuMC) |
| قاعدة البيانات: | IEEE Xplore Digital Library |
| ردمك: | 9782874870637 |
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| DOI: | 10.23919/EuMC50147.2022.9784272 |