Improvement of Twisting and Line-Edge Roughness of 3D NAND Deep Trench Etching on Yield Enhancement : AEPM: Advanced Equipment Processes and Materials

التفاصيل البيبلوغرافية
العنوان:	Improvement of Twisting and Line-Edge Roughness of 3D NAND Deep Trench Etching on Yield Enhancement : AEPM: Advanced Equipment Processes and Materials
المؤلفون:	Chung, Yao-An, Chiu, Yuan-Chieh, Chang, Yu-Fan, Lee, Hong-Ji, Lian, Nan-Tzu, Yang, Tahone, Chen, Kuang-Chao, Lu, Chih-Yuan
المصدر:	2022 33rd Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC) SEMI Advanced Semiconductor Manufacturing Conference (ASMC), 2022 33rd Annual. :1-4 May, 2022
Relation:	2022 33rd Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC)
قاعدة البيانات:	IEEE Xplore Digital Library