مؤتمر
Stress and Reliability Challenges of Underfills in Large-Size Fan-Out Multichip Module Packages
| العنوان: | Stress and Reliability Challenges of Underfills in Large-Size Fan-Out Multichip Module Packages |
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| المؤلفون: | Teng, Wen-Yu, Lee, Jackson, Tseng, Hsin-Ming, Hung, Liang Yih, Son Jiang, Don, Wang, Yu-Po |
| المصدر: | 2022 International Conference on Electronics Packaging (ICEP) Electronics Packaging (ICEP), 2022 International Conference on. :225-226 May, 2022 |
| Relation: | 2022 International Conference on Electronics Packaging (ICEP) |
| قاعدة البيانات: | IEEE Xplore Digital Library |
| ردمك: | 9784991191138 |
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| DOI: | 10.23919/ICEP55381.2022.9795431 |