مؤتمر
Study of Measurement Index on the Polymer-to-Metal Direct-adhesion for Package Carrier
| العنوان: | Study of Measurement Index on the Polymer-to-Metal Direct-adhesion for Package Carrier |
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| المؤلفون: | Pai, Yu-Cheng, Yeh, Chan-Yu, Teng, Wen-Yu, Kang, Andrew, Wang, Yu-Po |
| المصدر: | 2022 International Conference on Electronics Packaging (ICEP) Electronics Packaging (ICEP), 2022 International Conference on. :227-228 May, 2022 |
| Relation: | 2022 International Conference on Electronics Packaging (ICEP) |
| قاعدة البيانات: | IEEE Xplore Digital Library |
| ردمك: | 9784991191138 |
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| DOI: | 10.23919/ICEP55381.2022.9795493 |