التفاصيل البيبلوغرافية
| العنوان: |
Confined IMCs for low temperature and high throughput D2W bonding |
| المؤلفون: |
Derakhshandeh, Jaber, La Tulipe, Douglas Charles, Capuz, Giovanni, Cherman, Vladimir, Gerets, Carine, Cochet, Tom, Shafahian, Ehsan, Preter, Inge De, Jamieson, Geraldine, Webers, Tomas, Beyne, Eric, Beyer, Gerald, Miller, Andy |
| المصدر: |
2022 International Conference on Electronics Packaging (ICEP) Electronics Packaging (ICEP), 2022 International Conference on. :131-132 May, 2022 |
| Relation: |
2022 International Conference on Electronics Packaging (ICEP) |
| قاعدة البيانات: |
IEEE Xplore Digital Library |
