Heat management in monolithic 3D RF platform

التفاصيل البيبلوغرافية
العنوان: Heat management in monolithic 3D RF platform
المؤلفون: Jeong, Jaeyong, Kim, Seong Kwang, Kim, Jongmin, Geum, Dae-Myeong, Kim, SangHyeon
المصدر: 2022 6th IEEE Electron Devices Technology & Manufacturing Conference (EDTM) Electron Devices Technology & Manufacturing Conference (EDTM), 2022 6th IEEE. :79-81 Mar, 2022
Relation: 2022 6th IEEE Electron Devices Technology & Manufacturing Conference (EDTM)
قاعدة البيانات: IEEE Xplore Digital Library
الوصف
ردمك:9781665421782
DOI:10.1109/EDTM53872.2022.9798189