Investigation of the Short-circuit Failure Mechanisms in 1.2-kV SiC Trench MOSFETs with Thin N+ Substrates Using Electro-thermal-mechanical Analysis

التفاصيل البيبلوغرافية
العنوان: Investigation of the Short-circuit Failure Mechanisms in 1.2-kV SiC Trench MOSFETs with Thin N+ Substrates Using Electro-thermal-mechanical Analysis
المؤلفون: Kashiwa, Keisuke, Yao, Kailun, Yano, Hiroshi, Iwamuro, Noriyuki, Harada, Shinsuke
المصدر: 2022 IEEE 34th International Symposium on Power Semiconductor Devices and ICs (ISPSD) Power Semiconductor Devices and ICs (ISPSD), 2022 IEEE 34th International Symposium on. :113-116 May, 2022
Relation: 2022 IEEE 34th International Symposium on Power Semiconductor Devices and ICs (ISPSD)
قاعدة البيانات: IEEE Xplore Digital Library
الوصف
ردمك:9781665422017
9781665422000
تدمد:19460201
DOI:10.1109/ISPSD49238.2022.9813534