التفاصيل البيبلوغرافية
العنوان: |
Transient Thermal Modeling of Die Bond Process in Multiple Die Stacked Flash Memory Package |
المؤلفون: |
Liu, Yangming, Wang, Xu, Liu, Xiangyang, Huang, Shenghua, Chiu, Chin-Tien, Ye, Ning, Yang, Bo |
المصدر: |
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2022 IEEE 72nd. :513-518 May, 2022 |
Relation: |
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) |
قاعدة البيانات: |
IEEE Xplore Digital Library |