Super Fine Jet Underfill Dispense Technique for Robust Micro Joint in Direct Bonded Heterogeneous Integration (DBHi) Silicon Bridge Packages

التفاصيل البيبلوغرافية
العنوان:	Super Fine Jet Underfill Dispense Technique for Robust Micro Joint in Direct Bonded Heterogeneous Integration (DBHi) Silicon Bridge Packages
المؤلفون:	Horibe, Akihiro, Marushima, Chinami, Watanabe, Takahito, Jain, Aakrati, Turcotte, Eric, de Sousa, Isabel, Sikka, Kamal, Hisada, Takashi
المصدر:	2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2022 IEEE 72nd. :631-634 May, 2022
Relation:	2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)
قاعدة البيانات:	IEEE Xplore Digital Library