Die to Wafer Hybrid Bonding for Chiplet and Heterogeneous Integration: Die Size Effects Evaluation-Small Die Applications

التفاصيل البيبلوغرافية
العنوان:	Die to Wafer Hybrid Bonding for Chiplet and Heterogeneous Integration: Die Size Effects Evaluation-Small Die Applications
المؤلفون:	Gao, Guilian, Mirkarimi, Laura, Fountain, Gill, Suwito, Dominik, Theil, Jeremy, Workman, Thomas, Uzoh, Cyprian, Lee, Bongsub, Bang, K.M., Guevara, Gabe
المصدر:	2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2022 IEEE 72nd. :1975-1981 May, 2022
Relation:	2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)
قاعدة البيانات:	IEEE Xplore Digital Library