Reliability Assessment of Ultra-low-K dielectric Material and Demonstration in Advanced Interposers

التفاصيل البيبلوغرافية
العنوان:	Reliability Assessment of Ultra-low-K dielectric Material and Demonstration in Advanced Interposers
المؤلفون:	Bhaskar, Pragna, Blancher, Christopher, Kathaperumal, Mohan, Swaminathan, Madhavan, Losego, Mark D.
المصدر:	2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2022 IEEE 72nd. :62-66 May, 2022
Relation:	2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)
قاعدة البيانات:	IEEE Xplore Digital Library