التفاصيل البيبلوغرافية
| العنوان: |
Scalable Through Molding Interconnection realization for advanced Fan Out Wafer Level Packaging applications |
| المؤلفون: |
Plihon, Aurelia, Deschaseaux, Edouard, Franiatte, Remi, Dechamp, Jerome, Vaudaine, Simon, Guillaume, Jennifer, Brunet-Manquat, Catherine, Moreau, Stephane, Coudrain, Perceval |
| المصدر: |
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2022 IEEE 72nd. :2122-2127 May, 2022 |
| Relation: |
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) |
| قاعدة البيانات: |
IEEE Xplore Digital Library |
Full Text Finder