التفاصيل البيبلوغرافية
| العنوان: |
Investigation of Moisture-Induced Warpage of Chip-on-Wafer in 2.5D IC Package |
| المؤلفون: |
Shao, Shuai Alan, Chen, Shih-Yen Stan, Lee, Chien-Wei Ken, Chen, Yi-Ting Henry, Low, Shin, Singh, Inderjit |
| المصدر: |
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2022 IEEE 72nd. :1095-1102 May, 2022 |
| Relation: |
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) |
| قاعدة البيانات: |
IEEE Xplore Digital Library |
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