التفاصيل البيبلوغرافية
| العنوان: |
A Study on Warpage and Reflow Profile for Extreme Extension of Mass Reflow Bonding |
| المؤلفون: |
Shin, Jiwon, Woo, Kwangbok, Kwon, Donguk, Kim, Youngja, Lee, Youngmin, Kang, Dongwoo, Sahoo, Krutikesh, Ren, Haoxiang, Huang, Yu-Pei, Shah, Ujash, Yang, Yutao, Kuchhangi, Ankit, Iyer, Subramanian S. |
| المصدر: |
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2022 IEEE 72nd. :1158-1162 May, 2022 |
| Relation: |
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) |
| قاعدة البيانات: |
IEEE Xplore Digital Library |
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