Fine-Pitch 30 μm Cu-Cu Bonding by Using Low Temperature Microfluidic Electroless Interconnection

التفاصيل البيبلوغرافية
العنوان:	Fine-Pitch 30 μm Cu-Cu Bonding by Using Low Temperature Microfluidic Electroless Interconnection
المؤلفون:	Lin, Yung-Sheng, Hung, Yun-Ching, Kao, Chin-Li, Lai, Chung-Hung, Shih, Po-Shao, Huang, Jeng-Hau, Tarng, David, Kao, C. Robert
المصدر:	2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2022 IEEE 72nd. :177-181 May, 2022
Relation:	2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)
قاعدة البيانات:	IEEE Xplore Digital Library