التفاصيل البيبلوغرافية
العنوان: |
Substrate Silicon Wafer Integrated Fan-out Technology (S-SWIFT®) Packaging with Fine Pitch Embedded Trace RDL |
المؤلفون: |
Jin, SangHyun, Do, WonChul, Jeong, JinSuk, Cha, HyunGoo, Jeong, YunKyung, Khim, JinYoung |
المصدر: |
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2022 IEEE 72nd. :1355-1361 May, 2022 |
Relation: |
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) |
قاعدة البيانات: |
IEEE Xplore Digital Library |