Substrate Silicon Wafer Integrated Fan-out Technology (S-SWIFT®) Packaging with Fine Pitch Embedded Trace RDL

التفاصيل البيبلوغرافية
العنوان:	Substrate Silicon Wafer Integrated Fan-out Technology (S-SWIFT®) Packaging with Fine Pitch Embedded Trace RDL
المؤلفون:	Jin, SangHyun, Do, WonChul, Jeong, JinSuk, Cha, HyunGoo, Jeong, YunKyung, Khim, JinYoung
المصدر:	2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2022 IEEE 72nd. :1355-1361 May, 2022
Relation:	2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)
قاعدة البيانات:	IEEE Xplore Digital Library