Process-Reliability Relationships of SnBiAg and SnIn Solders for Component Attachment on Flexible Direct-Write Additive Circuits in Wearable Applications

التفاصيل البيبلوغرافية
العنوان:	Process-Reliability Relationships of SnBiAg and SnIn Solders for Component Attachment on Flexible Direct-Write Additive Circuits in Wearable Applications
المؤلفون:	Lall, Pradeep, Narangaparambil, Jinesh, Miller, Scott
المصدر:	2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2022 IEEE 72nd. :1172-1183 May, 2022
Relation:	2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)
قاعدة البيانات:	IEEE Xplore Digital Library