مؤتمر
Substrate designs to improve die crack damage in CSP
| العنوان: | Substrate designs to improve die crack damage in CSP |
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| المؤلفون: | Kao, N., Wang, Y.P., Chou, S., Tsai, Y.L., Her, T.D. |
| المصدر: | Advances in Electronic Materials and Packaging 2001 (Cat. No.01EX506) Electronics materials and packaging Electronic Materials and Packaging, 2001. EMAP 2001. Advances in. :444-449 2001 |
| Relation: | Advances in Electronic Materials and Packaging 2001 |
| قاعدة البيانات: | IEEE Xplore Digital Library |
Full Text Finder | ردمك: | 0780371577 9780780371576 |
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| DOI: | 10.1109/EMAP.2001.984025 |