دورية أكاديمية
Mechanical Characterization of Ultra-Thin, Flexible Glass Substrates for RF Applications
| العنوان: | Mechanical Characterization of Ultra-Thin, Flexible Glass Substrates for RF Applications |
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| المؤلفون: | Sivapurapu, S., Chen, R., Kanno, K., Kakutani, T., Letz, M., Liu, F., Sitaraman, S.K., Swaminathan, M. |
| المصدر: | IEEE Transactions on Components, Packaging and Manufacturing Technology IEEE Trans. Compon., Packag. Manufact. Technol. Components, Packaging and Manufacturing Technology, IEEE Transactions on. 12(9):1465-1473 Sep, 2022 |
| قاعدة البيانات: | IEEE Xplore Digital Library |
Full Text Finder | تدمد: | 21563950 21563985 |
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| DOI: | 10.1109/TCPMT.2022.3196912 |