دورية أكاديمية
Mechanical Characterization of Ultra-Thin, Flexible Glass Substrates for RF Applications
العنوان: | Mechanical Characterization of Ultra-Thin, Flexible Glass Substrates for RF Applications |
---|---|
المؤلفون: | Sivapurapu, S., Chen, R., Kanno, K., Kakutani, T., Letz, M., Liu, F., Sitaraman, S.K., Swaminathan, M. |
المصدر: | IEEE Transactions on Components, Packaging and Manufacturing Technology IEEE Trans. Compon., Packag. Manufact. Technol. Components, Packaging and Manufacturing Technology, IEEE Transactions on. 12(9):1465-1473 Sep, 2022 |
قاعدة البيانات: | IEEE Xplore Digital Library |
كن أول من يترك تعليقا!