التفاصيل البيبلوغرافية
| العنوان: |
Research on Reliability of SnAg1.8/Cu Solder Joints in Extreme Environment |
| المؤلفون: |
Zhou, Xiangsheng, Li, Yuechan, Yang, Xiaofeng, Xie, An, Wang, Haozhong, Cao, Chunyan |
| المصدر: |
2022 23rd International Conference on Electronic Packaging Technology (ICEPT) Electronic Packaging Technology (ICEPT), 2022 23rd International Conference on. :1-6 Aug, 2022 |
| Relation: |
2022 23rd International Conference on Electronic Packaging Technology (ICEPT) |
| قاعدة البيانات: |
IEEE Xplore Digital Library |
