التفاصيل البيبلوغرافية
| العنوان: |
Multi-physics Simulation and Design of Paralleled Silicon Carbide Dual Chip Module |
| المؤلفون: |
Gao, Lei, Gong, Tingrui, Meng, Yinghao, Yan, Xinzhu, Li, Juntao |
| المصدر: |
2022 23rd International Conference on Electronic Packaging Technology (ICEPT) Electronic Packaging Technology (ICEPT), 2022 23rd International Conference on. :1-4 Aug, 2022 |
| Relation: |
2022 23rd International Conference on Electronic Packaging Technology (ICEPT) |
| قاعدة البيانات: |
IEEE Xplore Digital Library |
