التفاصيل البيبلوغرافية
| العنوان: |
Enhanced thermomechanical and dielectric properties of the epoxy composites by incorporating SiO2 and BaTiO3 fillers |
| المؤلفون: |
Liu, Zheng, Luo, Suibin, Chu, Baojin, Yu, Shuhui |
| المصدر: |
2022 23rd International Conference on Electronic Packaging Technology (ICEPT) Electronic Packaging Technology (ICEPT), 2022 23rd International Conference on. :1-5 Aug, 2022 |
| Relation: |
2022 23rd International Conference on Electronic Packaging Technology (ICEPT) |
| قاعدة البيانات: |
IEEE Xplore Digital Library |
