التفاصيل البيبلوغرافية
| العنوان: |
Reliability Study of WLP for SAW Filter with Through Film Vias Using Laser Drilling technology |
| المؤلفون: |
Chen, Zuohuan, Zhao, Jin, Zhang, Jiqin, Zhang, Long, Yu, Daquan |
| المصدر: |
2022 23rd International Conference on Electronic Packaging Technology (ICEPT) Electronic Packaging Technology (ICEPT), 2022 23rd International Conference on. :1-3 Aug, 2022 |
| Relation: |
2022 23rd International Conference on Electronic Packaging Technology (ICEPT) |
| قاعدة البيانات: |
IEEE Xplore Digital Library |
