مؤتمر
Effects of Sintering Parameters on Silver Joints Prepared with Micron Silver Paste for Power Electronics
| العنوان: | Effects of Sintering Parameters on Silver Joints Prepared with Micron Silver Paste for Power Electronics |
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| المؤلفون: | Chen, Zehao, Huang, Shijun, Li, Cai-Fu |
| المصدر: | 2022 23rd International Conference on Electronic Packaging Technology (ICEPT) Electronic Packaging Technology (ICEPT), 2022 23rd International Conference on. :1-5 Aug, 2022 |
| Relation: | 2022 23rd International Conference on Electronic Packaging Technology (ICEPT) |
| قاعدة البيانات: | IEEE Xplore Digital Library |
| ردمك: | 9781665499057 |
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| DOI: | 10.1109/ICEPT56209.2022.9873358 |