التفاصيل البيبلوغرافية
| العنوان: |
Bonding Process of Copper Foam-Silver Composite and Performance Characterization of the Joint |
| المؤلفون: |
Lv, Guoping, Yan, Haidong, He, Siliang, Yang, Daoguo, Wu, Xinke, Sheng, Kuang, Liu, Chaohui, Zhang, Yakun, Zhang, Guoqi |
| المصدر: |
2022 23rd International Conference on Electronic Packaging Technology (ICEPT) Electronic Packaging Technology (ICEPT), 2022 23rd International Conference on. :1-5 Aug, 2022 |
| Relation: |
2022 23rd International Conference on Electronic Packaging Technology (ICEPT) |
| قاعدة البيانات: |
IEEE Xplore Digital Library |
