التفاصيل البيبلوغرافية
| العنوان: |
Failure analysis and improvement research on high lead solder bump of flip chip FPGA for aerospace |
| المؤلفون: |
Cao, Rui, Wu, Yaning, Zhu, Hengjing, Duan, Chao, Meng, Meng, Sun, Ming |
| المصدر: |
2022 23rd International Conference on Electronic Packaging Technology (ICEPT) Electronic Packaging Technology (ICEPT), 2022 23rd International Conference on. :1-5 Aug, 2022 |
| Relation: |
2022 23rd International Conference on Electronic Packaging Technology (ICEPT) |
| قاعدة البيانات: |
IEEE Xplore Digital Library |
