مؤتمر
Finite Element Simulations of Flip Chip Solder Bumps with Fractures Present using FreeFem++
| العنوان: | Finite Element Simulations of Flip Chip Solder Bumps with Fractures Present using FreeFem++ |
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| المؤلفون: | Ren, Hao, Zhou, Peng, Zhou, Chunming |
| المصدر: | 2022 23rd International Conference on Electronic Packaging Technology (ICEPT) Electronic Packaging Technology (ICEPT), 2022 23rd International Conference on. :1-5 Aug, 2022 |
| Relation: | 2022 23rd International Conference on Electronic Packaging Technology (ICEPT) |
| قاعدة البيانات: | IEEE Xplore Digital Library |
| ردمك: | 9781665499057 |
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| DOI: | 10.1109/ICEPT56209.2022.9873483 |