مؤتمر
Measurement and Analysis of the Peel Strength for Solder Joints in LGA Electronic Assembly Using Statistical Methods
| العنوان: | Measurement and Analysis of the Peel Strength for Solder Joints in LGA Electronic Assembly Using Statistical Methods |
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| المؤلفون: | Tsenev, Valentin, Peshev, Nedvalko |
| المصدر: | 2022 13th National Conference with International Participation (ELECTRONICA) International Participation (ELECTRONICA), 2022 13th National Conference with. :1-4 May, 2022 |
| Relation: | 2022 13th National Conference with International Participation (ELECTRONICA) |
| قاعدة البيانات: | IEEE Xplore Digital Library |
| ردمك: | 9781665480994 9781665481007 |
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| DOI: | 10.1109/ELECTRONICA55578.2022.9874402 |